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When conducting a new PCB layout, circuit designers must copy the latest component library from the component library administrator. If components beyond the existing library are required, designers may either create a new library by themselves and file it with the administrator, or provide component dimension data for the administrator to create the library.
If circuit designers encounter component library-related issues during PCB layout or production, they shall promptly report to the administrator, who will then make modifications and file the changes for record.
When modifying a PCB, designers must re-copy the component library and refer to the Component Library Modification Record Form and Component Library Update Record Form to determine whether an update to the component library is necessary.
LIB-V3.0 is divided into the Schematic Component Library and the PCB Component Library.
The Schematic Component Library is further divided into SMC (Surface Mount Component Library) and THC (Through-Hole Component Library).
(II) The PCB Component Library is divided into SMC (Surface Mount Component Library) and THC (Through-Hole Component Library).
III. Naming Instructions for Schematic Components
(I) Surface Mount Component Library (SMC)
Note: ⑴ MARK is stored in SM-OTHER;
⑵ Special components shall be named separately.
(II) Through-Hole Component Library (THC)
IV. Naming Instructions for PCB Component Footprints
(I) Surface Mount Component Library (SMC)
Note:
(1) Special components shall be named separately;
(2) The angle of surface mount components takes the direction shown in the diagram as 0 degrees;
(3) Except for special components, the geometric center of the component's pad shall be taken as the coordinate origin for surface mount components;
(II) Through-Hole Components
Note: (1) TH-OTHER refers to components outside the previous categories, such as crystals, surface acoustic wave devices, etc. All components in this category are named after their model numbers, and correspond one-to-one with the schematic diagram;
V. Component Size Specifications
(I) Size specifications for surface mount components: The definition of pad sizes for surface mount components shall comply with IPC standards or component specifications.
Component Size Pad Size
2、Chip Capacitors
(II) Specifications for pad sizes of through-hole components: The pad sizes of through-hole components shall refer to the pad sizes of through-hole components in the CAD system of the TV company.
VI. Calculation formula for SMD component pads
Take Chip Resistors as an example.
Among them: For the component pad size, Z = Zmax; G = Gmin; X = Xmax.
Lmin: Minimum length of the component (shall be specified in the component specification sheet)
Smin: Shall be specified in the component specification sheet
Wmin: Shall be specified in the component specification sheet
JTmin: If not specified in the specification sheet, it shall be estimated as 0.4-0.6mm
JHmin: If not specified in the specification sheet, it shall be estimated as 0-0.2mm
Jgmin: If not specified in the specification sheet, it shall be estimated as -0.02-0.02mm
F: PCB processing accuracy. If not specified, it shall be estimated as 1.0mm.
P: Component placement accuracy. If not specified, it shall be estimated as 1.0mm.
C: Component accuracy, which shall be specified in the component specification sheet.
Note: If the component specification sheet specifies the pad size, the library shall be created according to the value specified in the specification sheet. If the component specification sheet does not specify the component size, the pad size shall be calculated according to the above formula.
PCB Component Library Update Record Form (Appendix 1)
PCB Component Library Modification Record Form (Appendix 2)